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On Modified Temperature Model for Synchronous Chip Seal
Waterproof Binder Course on the Concrete Bridge
LI Zhi-dong，
，HUANG Xiao-ming，CHEN Guang-xiu，CHEN Xiao-xue
2011, 30(5):
957-964.
DOI: 10.3969/j.issn.1674-0696.2011.05.016
To make bonding and shear resistance strength of synchronous chip seal waterproof binder course under different
temperature comparable，the difference of air temperature，deck and waterproof binder course temperature，the design of
waterproof binder course and the sensitivity of the strength to the different temperature was studied． It showed that the
strength was maximal when asphalt and chip is 1． 2 kg /m2 and 8 kg /m2 ; the strength between courses was sensitive to the
temperature and the detected strength under the binder temperature and deck temperature corresponding to the same reduced
by 38% to 80%，therefore the strength should be detected under the waterproof binder course temperature． Finally，the
correlation coefficient R2 of calculation model of the binder，direct，torsion strength established was above 0． 94; After regressing
theoretical model of binding，direct shear，and torsion shear intensity of waterproof bingder course，modified coefficient
Ki was proposed; the strength under different temperature could be converted to the standard strength below 25℃ by
the establishing of P25modified model of the temperature．
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